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Pressure
Freescale Semiconductor Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPxx5004 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.
MPXV5004G Rev 12, 09/2009
MPXV5004 MPVZ5004 Series
0 to 3.92 kPa (0 to 400 mm H2O) 1.0 to 4.9 V Output
Application Examples
* Washing Machine Water Level * Ideally Suited for Microprocessor or Microcontroller-Based Systems * Appliance Liquid Level and Pressure Measurement * Respiratory Equipment
Features
* * * * * *
1.5% Maximum Error for 0 to 100 mm H2O over +10 to +60C with Auto Zero 2.5% Maximum Error for 100 to 400 mm H2O over +10 to +60C with Auto Zero 6.25% Maximum Error for 0 to 400 mm H2O over +10 to +60C without Auto Zero Temperature Compensated over 10 to 60C Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations Durable Thermoplastic (PPS) Package ORDERING INFORMATION
Device Name Case No. 1351 482A 482A 482C 1369 1369 1368 482 482 482B 482A 1735 1560 * * * * * * * * * * * * # of Ports None Single Dual * * * * * * * * * * * * * Gauge Pressure Type Differential * Absolute Device Marking MPXV5004DP MPXV5004G MPXV5004G MPXV5004G MPXV5004GP MPXV5004GP MPXV5004GVP MPVZ5004G MPVZ5004G MPVZ5004G MPVZ5004G MZ5004GW MZ5004GW
Small Outline Package (MPXV5004 Series) MPXV5004DP MPXV5004GC6T1 MPXV5004GC6U MPXV5004GC7U MPXV5004GP MPXV5004GPT1 MPXV5004GVP MPVZ5004G6T1 MPVZ5004G6U MPVZ5004G7U MPVZ5004GC6U MPVZ5004GW6U MPVZ5004GW7U
Small Outline Package (Media Resistant Gel) (MPVZ5004 Series)
(c) Freescale Semiconductor, Inc., 2006-2009. All rights reserved.
Pressure
SMALL OUTLINE PACKAGES THROUGH-HOLE
MPVZ5004G7U CASE 482B-03
MPXV5004GC7U CASE 482C-03
MPVZ5004GW7U CASE 1560-02
SMALL OUTLINE PACKAGES SURFACE MOUNT
MPVZ5004G6U/6T1 CASE 482-01
MPXV5004G6U/6T1, MPVZ5004GC6U CASE 482A-01
MPXV5004DP CASE 1351-01
MPXV5004GVP CASE 1368-01
MPVZ5004GW6U CASE 1735-01
MPXV5004GP/GPT1 CASE 1369-01
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Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 VDC, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Pressure Range Supply Voltage(1) Supply Current Span @ 306 mm H2O (3 Full Scale Span @ 400 mm H2O (3.92 kPa)(2) Offset(3) Sensitivity Accuracy (4) (5) 0 to 100 mm H2O (10 to 60C) 100 to 400 mm H2O (10 to 60C) 0 to 400 mm H2O (10 to 60C 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. Offset Stability:Output deviation, after 1000 temperature cycles, -30 to 100C, and 1.5 million pressure cycles, with minimum rated pressure applied. TcSpan:Output deviation over the temperature range of 10 to 60C, relative to 25C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60C, relative to 25C. Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPVZ5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of 5C between autozero and measurement. kPa)(2) Symbol POP VS IS VFSS VOFF V/P -- -- -- Min 0 4.75 -- -- -- 0.75 -- -- -- -- Typ -- 5.0 -- 3.0 4.0 1.0 1.0 -- -- -- Max 3.92 400 5.25 10 -- -- 1.25 -- 1.5 2.5 6.25 Units kPa mm H2O VDC mAdc V V V/kPa %VFSS with auto zero %VFSS with auto zero %VFSS without auto zero
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Maximum Ratings
Table 2. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 16 -30 to +100 0 to +85 Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS 2
Sensing Element
Thin Film Temperature Compensation and Calibration Circuitry
Gain Stage #2 and Ground Reference Shift Circuitry
4
VOUT
3 GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device.
Figure 1. Integrated Pressure Sensor Schematic
On-chip Temperature Compensation and Calibration
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPxx5004G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and
Fluorosilicone Gel Die Coat P1 Wire Bond Thermoplastic Case
qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MPxx5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10C to 60C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
Stainless Steel Cap
Die
Lead Frame
P2 Differential Sensing Element
Die Bond
Figure 2. Cross-Sectional Diagram (Not to Scale)
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Pressure
+5 V
Vout Vs IPS 1.0 F 0.01 F GND
OUTPUT
470 pF
Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to AN1646.)
5.0 4.0 3.0 Output (V) TYPICAL Output (V) MAX 2.0 1.0 0 MIN TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] 6.25% VFSS VS = 5.0 Vdc TEMP = 10 to 60C
5.0 4.0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] 2.5% VFSS VS = 5.0 Vdc TEMP = 10 to 60C MAX 2.0 1.0 0 MIN
3.0 TYPICAL
0
1.0
2.0 Differential Pressure (kPa)
3.0
4.0
0
1.0
2.0 Differential Pressure (kPa)
3.0
4.0
Figure 4. Output vs. Pressure Differential at 6.25% VFSS (without auto zero, Table 1., note 5)
Figure 5. Output vs. Pressure Differential at 2.5% VFSS (with auto zero, Table 1., note 5))
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below.
Pressure (P1) Side Identifier Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Stainless Steel Cap Stainless Steel Cap Stainless Steel Cap Vertical Port Attached Vertical Port Attached
Part Number MPXV5004DP MPXV5004GC6U/6T1, MPVZ5004GC6U MPXV5004GC7U MPXV5004GP/GPT1 MPXV5004GVP MPVZ5004G6U/6T1 MPVZ5004G7U MPVZ5004GW6U MPVZ5004GW7U
Case Type 1351 482A 482C 1369 1368 482 482B 1735 1560
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INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.660 16.76
0.100 TYP 8X 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
SCALE 2:1
Figure 6. SOP Footprint (Case 482)
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PACKAGE DIMENSIONS
-A4 5
D 8 PL 0.25 (0.010)
M
TB
S
A
S
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41
S
N C H -TPIN 1 IDENTIFIER SEATING PLANE
J K M
DIM A B C D G H J K M N S
CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE SURFACE MOUNT
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT
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PACKAGE DIMENSIONS
-A-
4 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. S DIM A B C D G J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.210 0.220 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.405 0.415 0.540 0.560 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.33 5.59 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 10.29 10.54 13.72 14.22
-B- G
8 1
0.25 (0.010) S N
M
TB
D 8 PL SA
DETAIL X
PIN 1 IDENTIFIER
C -T- K M J DETAIL X
SEATING PLANE
CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE
-A4 5
N
-BG
8 1
0.25 (0.010)
M
TB
D 8 PL S A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.
S DIM A B C D G J K M N S V W SEATING PLANE INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 13.21 0.520 12.70 0.500 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15 0 15 0 11.38 0.448 11.28 0.444 14.22 0.560 13.72 0.540 6.48 6.22 0.255 0.245 3.17 2.92 0.125 0.115
DETAIL X S W
V C
PIN 1 IDENTIFIER
-TK M J DETAIL X
CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE
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MPXV5004G Rev. 12 09/2009

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